Invention Grant
US08524847B2 Organic insulating material, varnish for resin film using the same, resin film and semiconductor device
失效
有机绝缘材料,使用其的树脂膜用清漆,树脂膜和半导体器件
- Patent Title: Organic insulating material, varnish for resin film using the same, resin film and semiconductor device
- Patent Title (中): 有机绝缘材料,使用其的树脂膜用清漆,树脂膜和半导体器件
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Application No.: US13050943Application Date: 2011-03-18
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Publication No.: US08524847B2Publication Date: 2013-09-03
- Inventor: Yohko Sano , Mihoko Matsutani , Kazuyoshi Fujita
- Applicant: Yohko Sano , Mihoko Matsutani , Kazuyoshi Fujita
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee: Sumitomo Bakelite Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2007-073129 20070320; JP2007-250230 20070926
- Main IPC: C08L55/00
- IPC: C08L55/00 ; C08F38/02 ; C08F36/02

Abstract:
An organic insulating material includes a prepolymer of a cage structure compound having a polymerizable unsaturated bond-containing group and a cage structure with an adamantane structure as the minimal unit. The prepolymer has a number-average molecular weight of between 2,000 and 500,000 based on polystyrene and measured by gel permeation chromatography. The prepolymer includes unsaturated bonds produced by reaction between the polymerizable unsaturated bonds and the unreacted polymerizable unsaturated bonds. The prepolymer has a residue rate of unreacted polymerizable unsaturated bonds of between 20% and 80%.
Public/Granted literature
- US20110172351A1 ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE Public/Granted day:2011-07-14
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