Invention Grant
US08524931B2 Precursor compositions for ALD/CVD of group II ruthenate thin films
有权
用于II组钌酸盐薄膜的ALD / CVD的前体组合物
- Patent Title: Precursor compositions for ALD/CVD of group II ruthenate thin films
- Patent Title (中): 用于II组钌酸盐薄膜的ALD / CVD的前体组合物
-
Application No.: US12523704Application Date: 2007-03-12
-
Publication No.: US08524931B2Publication Date: 2013-09-03
- Inventor: Chongying Xu , Bryan C. Hendrix , Thomas M. Cameron , Jeffrey F. Roeder , Matthias Stender , Tianniu Chen
- Applicant: Chongying Xu , Bryan C. Hendrix , Thomas M. Cameron , Jeffrey F. Roeder , Matthias Stender , Tianniu Chen
- Applicant Address: US CT Danbury
- Assignee: Advanced Technology Materials, Inc.
- Current Assignee: Advanced Technology Materials, Inc.
- Current Assignee Address: US CT Danbury
- Agency: Hultquist, PLLC
- Agent Mary B. Grant; Maggie Chappuis
- International Application: PCT/US2007/063831 WO 20070312
- International Announcement: WO2008/088563 WO 20080724
- Main IPC: C07F15/00
- IPC: C07F15/00 ; C03C17/10

Abstract:
Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO3) thin films, e.g., in the manufacture of microelectronic devices, as well as processes of making and using such precursors, and precursor supply systems containing such precursor compositions in packaged form. Cyclopentadienyl compounds of varied type are described, including cyclopentadienyl as well as non cyclopentadienyl ligands coordinated to ruthenium, strontium or barium central atoms. The precursors of the invention are useful for forming contacts for microelectronic memory device structures, and in a specific aspect for selectively coating copper metallization without deposition on associated dielectric, under deposition conditions in a forming gas ambient.
Public/Granted literature
- US20100095865A1 PRECURSOR COMPOSITIONS FOR ALD/CVD OF GROUP II RUTHENATE THIN FILMS Public/Granted day:2010-04-22
Information query