Invention Grant
- Patent Title: Suspension board with circuit and producing method thereof
- Patent Title (中): 具有电路的悬挂板及其制造方法
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Application No.: US13325815Application Date: 2011-12-14
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Publication No.: US08525037B2Publication Date: 2013-09-03
- Inventor: Masaki Mizutani
- Applicant: Masaki Mizutani
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2011-004248 20110112
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A suspension board with circuit includes a gimbal portion. The gimbal portion includes a tongue portion formed at the inner side of the opening for being mounted with a slider mounted with a magnetic head for being electrically connected to the conductive layer, an outrigger portion formed at the outer side of the opening to support the tongue portion, and a passing portion passing through the opening of the gimbal portion and/or an outer side region of the outrigger portion. The passing portion includes the conductive layer and the insulating layer covering the conductive layer. The thickness of a lower half portion of the insulating layer in the passing portion is the same as that of an upper half portion thereof.
Public/Granted literature
- US20120175151A1 SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF Public/Granted day:2012-07-12
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