Invention Grant
- Patent Title: Wire guide housing for wire electrical discharge machining device
- Patent Title (中): 线材导线罩用于电火花加工装置
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Application No.: US13063694Application Date: 2009-09-16
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Publication No.: US08525062B2Publication Date: 2013-09-03
- Inventor: Akira Sato , Yoshiaki Arikawa
- Applicant: Akira Sato , Yoshiaki Arikawa
- Applicant Address: JP Kanagawa
- Assignee: Sodick Co., Ltd.
- Current Assignee: Sodick Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: J.C. Patents
- Priority: JP2008-235889 20080916
- International Application: PCT/JP2009/004661 WO 20090916
- International Announcement: WO2010/032460 WO 20100325
- Main IPC: B23H7/10
- IPC: B23H7/10

Abstract:
A wire guide housing (1) which contains a wire guide (6) for supporting a running wire electrode (W) and in which a wire running passage (32, 23b, 41, 26, 63, 66a) through which the wire electrode passes is formed. The wire guide housing includes: a cleaning liquid supply opening (43), for introducing a cleaning liquid (C) into the wire guide housing; a cleaning liquid discharge opening (44), for discharging the cleaning liquid from the wire guide housing; a first flow passage (46), for connecting the cleaning liquid supply opening to the wire running passage; and a second flow passage (48), for connecting the wire running passage to the cleaning liquid discharge opening. The cleaning liquid flows into the wire running passage at a side more upstream than the wire guide.
Public/Granted literature
- US20110233172A1 WIRE GUIDE HOUSING FOR WIRE ELECTRICAL DISCHARGE MACHINING DEVICE Public/Granted day:2011-09-29
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