Invention Grant
US08525062B2 Wire guide housing for wire electrical discharge machining device 有权
线材导线罩用于电火花加工装置

  • Patent Title: Wire guide housing for wire electrical discharge machining device
  • Patent Title (中): 线材导线罩用于电火花加工装置
  • Application No.: US13063694
    Application Date: 2009-09-16
  • Publication No.: US08525062B2
    Publication Date: 2013-09-03
  • Inventor: Akira SatoYoshiaki Arikawa
  • Applicant: Akira SatoYoshiaki Arikawa
  • Applicant Address: JP Kanagawa
  • Assignee: Sodick Co., Ltd.
  • Current Assignee: Sodick Co., Ltd.
  • Current Assignee Address: JP Kanagawa
  • Agency: J.C. Patents
  • Priority: JP2008-235889 20080916
  • International Application: PCT/JP2009/004661 WO 20090916
  • International Announcement: WO2010/032460 WO 20100325
  • Main IPC: B23H7/10
  • IPC: B23H7/10
Wire guide housing for wire electrical discharge machining device
Abstract:
A wire guide housing (1) which contains a wire guide (6) for supporting a running wire electrode (W) and in which a wire running passage (32, 23b, 41, 26, 63, 66a) through which the wire electrode passes is formed. The wire guide housing includes: a cleaning liquid supply opening (43), for introducing a cleaning liquid (C) into the wire guide housing; a cleaning liquid discharge opening (44), for discharging the cleaning liquid from the wire guide housing; a first flow passage (46), for connecting the cleaning liquid supply opening to the wire running passage; and a second flow passage (48), for connecting the wire running passage to the cleaning liquid discharge opening. The cleaning liquid flows into the wire running passage at a side more upstream than the wire guide.
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