Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13531279Application Date: 2012-06-22
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Publication No.: US08525184B2Publication Date: 2013-09-03
- Inventor: Masaya Okada , Makato Kiyama , Seiji Yaegashi , Ken Nakata
- Applicant: Masaya Okada , Makato Kiyama , Seiji Yaegashi , Ken Nakata
- Applicant Address: JP Osaka JP Yokohama-shi
- Assignee: Sumitomo Electric Industries, Ltd.,Sumitomo Electric Device Innovations, Inc.
- Current Assignee: Sumitomo Electric Industries, Ltd.,Sumitomo Electric Device Innovations, Inc.
- Current Assignee Address: JP Osaka JP Yokohama-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2009-178324 20090730
- Main IPC: H01L29/15
- IPC: H01L29/15

Abstract:
There are provided a semiconductor device that includes a bypass protection unit against surge voltage or the like, achieves good withstand voltage characteristics and low on-resistance (low On-state voltage), has a simple structure, and is used for large-current purpose and a method for producing the semiconductor device.In the present invention, the semiconductor device includes an n+-type GaN substrate 1 having a GaN layer that is in ohmic contact with a supporting substrate, a FET having an n−-type GaN drift layer 2 in a first region R1, and an SBD having an anode electrode in a second region R2, the anode electrode being in Schottky contact with the d−-type GaN drift layer 2. The FET and the SBD are arranged in parallel. A drain electrode D of the FET and a cathode electrode C of the SBD are formed on the back of the n+-type GaN substrate 1.
Public/Granted literature
- US20120273797A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2012-11-01
Information query
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