Invention Grant
- Patent Title: Die package including substrate with molded device
- Patent Title (中): 模具包装，包括具有模制装置的基材
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Application No.: US13246682Application Date: 2011-09-27
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Publication No.: US08525192B2Publication Date: 2013-09-03
- Inventor: Yong Liu , Zhongfa Yuan
- Applicant: Yong Liu , Zhongfa Yuan
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Christensen, O'Connor, Johnson, Kindness PLLC
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L31/12 ; H01L33/00
Abstract:
A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.
Public/Granted literature
- US20120012993A1 DIE PACKAGE INCLUDING SUBSTRATE WITH MOLDED DEVICE Public/Granted day:2012-01-19
Information query
IPC分类:
