Invention Grant
US08525202B2 LED package, method for manufacturing LED package, and packing member for LED package
有权
LED封装，LED封装制造方法，LED封装用包装件
- Patent Title: LED package, method for manufacturing LED package, and packing member for LED package
- Patent Title (中): LED封装，LED封装制造方法，LED封装用包装件
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Application No.: US12849102Application Date: 2010-08-03
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Publication No.: US08525202B2Publication Date: 2013-09-03
- Inventor: Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
- Applicant: Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Priority: JP2010-019780 20100129
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.
Public/Granted literature
- US20110186900A1 LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND PACKING MEMBER FOR LED PACKAGE Public/Granted day:2011-08-04
Information query
IPC分类:
