Invention Grant
US08525211B2 Light emitting device package and a lighting unit with base having via hole
有权
发光器件封装和具有通孔的基座的照明单元
- Patent Title: Light emitting device package and a lighting unit with base having via hole
- Patent Title (中): 发光器件封装和具有通孔的基座的照明单元
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Application No.: US13618598Application Date: 2012-09-14
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Publication No.: US08525211B2Publication Date: 2013-09-03
- Inventor: Yong Seok Choi
- Applicant: Yong Seok Choi
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2007-0063771 20070627
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
Provided are a light emitting device package and a lighting device. The light emitting device package includes a base having a via hole passing through a top surface thereof and a bottom surface thereof, a plurality of electrodes formed on the top surface of the base, the plurality of electrodes being electrically connected to a lower portion of the base through the via hole of the base, a frame disposed on the base, the frame having an opening and a light emitting device electrically connected to at least one of the plurality of electrodes in the opening of the frame. A width of the base is wider than a width of the frame, and material having light reflectivity is disposed on the frame.
Public/Granted literature
- US20130015485A1 LIGHT EMITTING DEVICE PACKAGE AND A LIGHTING UNIT Public/Granted day:2013-01-17
Information query
IPC分类: