Invention Grant
US08525215B2 Light emitting device, method of manufacturing the same, light emitting device package, and lighting system 有权
发光器件,其制造方法,发光器件封装和照明系统

Light emitting device, method of manufacturing the same, light emitting device package, and lighting system
Abstract:
Provided are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes: a light emitting structure layer including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; an oxide protrusion disposed on at least a portion of the second conducive semiconductor layer; and a current spreading layer on the second conductive semiconductor layer and the oxide protrusion.
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