Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12964218Application Date: 2010-12-09
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Publication No.: US08525227B2Publication Date: 2013-09-03
- Inventor: Woo Chul Jeon , Ki Yeol Park , Young Hwan Park , Jung Hee Lee
- Applicant: Woo Chul Jeon , Ki Yeol Park , Young Hwan Park , Jung Hee Lee
- Applicant Address: KR Suwon, Gyunggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0027391 20100326
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
There is provided a semiconductor device including a base substrate; a semiconductor layer formed on the base substrate and having a mesa protrusion including a receiving groove; a source electrode and a drain electrode disposed to be spaced apart from each other on the semiconductor layer, the source electrode having a source leg and the drain electrode having a drain leg; and a gate electrode insulated from the source electrode and the drain electrode and having a recess part received into the receiving groove. The mesa protrusion has a superlattice structure including at least one trench at an interface between the mesa protrusion and the source electrode and between the mesa protrusion and the drain electrode, respectively, and the source leg and the drain leg are received in the trench.
Public/Granted literature
- US20110233520A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-09-29
Information query
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