Invention Grant
US08525258B2 Method for controlling impurity density distribution in semiconductor device and semiconductor device made thereby
有权
用于控制由此制造的半导体器件和半导体器件中的杂质浓度分布的方法
- Patent Title: Method for controlling impurity density distribution in semiconductor device and semiconductor device made thereby
- Patent Title (中): 用于控制由此制造的半导体器件和半导体器件中的杂质浓度分布的方法
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Application No.: US12817413Application Date: 2010-06-17
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Publication No.: US08525258B2Publication Date: 2013-09-03
- Inventor: Tsung-Yi Huang , Ying-Shiou Lin
- Applicant: Tsung-Yi Huang , Ying-Shiou Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Richtek Technology Corporation, R.O.C.
- Current Assignee: Richtek Technology Corporation, R.O.C.
- Current Assignee Address: TW Hsin-Chu
- Agency: Tung & Associates
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
The present invention discloses a method for controlling the impurity density distribution in semiconductor device and a semiconductor device made thereby. The control method includes the steps of: providing a substrate; defining a doped area which includes at least one first region; partially masking the first region by a mask pattern; and doping impurities in the doped area to form one integrated doped region in the first region, whereby the impurity concentration of the first region is lower than a case where the first region is not masked by the mask pattern.
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