Invention Grant
- Patent Title: Bipolar punch-through semiconductor device and method for manufacturing such a semiconductor device
- Patent Title (中): 双极穿通半导体器件及其制造方法
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Application No.: US13523184Application Date: 2012-06-14
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Publication No.: US08525302B2Publication Date: 2013-09-03
- Inventor: Sven Matthias
- Applicant: Sven Matthias
- Applicant Address: CH Zurich
- Assignee: ABB Technology AG
- Current Assignee: ABB Technology AG
- Current Assignee Address: CH Zurich
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: EP11169792 20110614
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A bipolar diode is provided having a drift layer of a first conductivity type on a cathode side and an anode layer of a second conductivity type on an anode side. The anode layer includes a diffused anode contact layer and a double diffused anode buffer layer. The anode contact layer is arranged up to a depth of at most 5 μm, and the anode buffer layer is arranged up to a depth of 18 to 25 μm. The anode buffer layer has a doping concentration between 8.0*1015 and 2.0*1016 cm−3 in a depth of 5 μm and between 1.0*1014 up to 5.0*1014 cm−3 in a depth of 15 μm (Split C and D), resulting in good softness of the device and low leakage current. Split A and B show anode layer doping concentrations of known diodes, which have either over all depths lower doping concentrations resulting in high leakage current or enhanced doping concentration resulting in bad softness.
Public/Granted literature
- US20120319227A1 BIPOLAR PUNCH-THROUGH SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SUCH A SEMICONDUCTOR DEVICE Public/Granted day:2012-12-20
Information query
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