Invention Grant
- Patent Title: Semiconductor device, lead frame assembly, and method for fabricating the same
- Patent Title (中): 半导体装置，引线框组件及其制造方法
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Application No.: US13192167Application Date: 2011-07-27
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Publication No.: US08525307B2Publication Date: 2013-09-03
- Inventor: Kenichi Ito , Shigehisa Oonakahara , Yoshikazu Tamura , Kiyoshi Fujihara
- Applicant: Kenichi Ito , Shigehisa Oonakahara , Yoshikazu Tamura , Kiyoshi Fujihara
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-168457 20100727
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
Public/Granted literature
- US20120025361A1 SEMICONDUCTOR DEVICE, LEAD FRAME ASSEMBLY, AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-02-02
Information query
IPC分类:
