Invention Grant
- Patent Title: Stacked packaging improvements
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Application No.: US11666975Application Date: 2005-11-03
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Publication No.: US08525314B2Publication Date: 2013-09-03
- Inventor: Belgacem Haba , Craig S. Mitchell , Masud Beroz
- Applicant: Belgacem Haba , Craig S. Mitchell , Masud Beroz
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- International Application: PCT/US2005/039716 WO 20051103
- International Announcement: WO2006/052616 WO 20060518
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the leads project from this substrate. Lead frame (452) is joined to a further substrate (470) with one or more microelectronic elements (436, 404, 406) disposed between the substrates.
Public/Granted literature
- US20090104736A1 Stacked Packaging Improvements Public/Granted day:2009-04-23
Information query
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