Invention Grant
- Patent Title: Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
-
Application No.: US12828492Application Date: 2010-07-01
-
Publication No.: US08525335B2Publication Date: 2013-09-03
- Inventor: Shinji Wakisaka , Takeshi Wakabayashi
- Applicant: Shinji Wakisaka , Takeshi Wakabayashi
- Applicant Address: JP Tokyo
- Assignee: Teramikros, Inc.
- Current Assignee: Teramikros, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2009-158618 20090703; JP2009-158622 20090703; JP2009-158629 20090703
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/485
Abstract:
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.
Public/Granted literature
Information query
IPC分类:
