Invention Grant
- Patent Title: Boundary acoustic wave device
- Patent Title (中): 边界声波装置
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Application No.: US13252221Application Date: 2011-10-04
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Publication No.: US08525385B2Publication Date: 2013-09-03
- Inventor: Takashi Yamane
- Applicant: Takashi Yamane
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-097931 20090414
- Main IPC: H03H9/25
- IPC: H03H9/25

Abstract:
In a boundary acoustic wave device, a silicon oxide layer and a dielectric layer exhibiting a higher acoustic velocity than the silicon oxide layer are stacked on a LiTaO3 piezoelectric substrate, and IDT electrodes are disposed in grooves in an upper surface of the piezoelectric substrate. Each of the IDT electrodes includes a main electrode layer made of a metal having a density of about 16 g/cm3 or higher, and an auxiliary electrode layer made of a metal having a density within a range of about 3 g/cm3 to about 16 g/cm3. Further, θ of Euler angles (0°, θ, 0°) of the piezoelectric substrate is set within a range of about (θ0−20°) to about (θ0+20°) with respect to θ0 expressed by the formula: θ0=65.53G+0.7568F+0.8454E+7.091D+1.609C−0.03789B−3.535A+60.85.
Public/Granted literature
- US20120262028A1 BOUNDARY ACOUSTIC WAVE DEVICE Public/Granted day:2012-10-18
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