Invention Grant
- Patent Title: Illumination source with direct die placement
- Patent Title (中): 具有直接裸片放置的照明源
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Application No.: US13025791Application Date: 2011-02-11
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Publication No.: US08525396B2Publication Date: 2013-09-03
- Inventor: Frank Tin Chung Shum , Clifford Jue
- Applicant: Frank Tin Chung Shum , Clifford Jue
- Applicant Address: US CA Fremont
- Assignee: Soraa, Inc.
- Current Assignee: Soraa, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01J61/52
- IPC: H01J61/52
Abstract:
An illumination source includes a heat sink with a planar inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is affixed to the planar substrate and an adhesive layer between the planar substrate and the planar inner core region conducts heat from the LED assembly to the inner core region.
Public/Granted literature
- US20110204763A1 Illumination Source with Direct Die Placement Public/Granted day:2011-08-25
Information query
