Invention Grant
- Patent Title: Coupler
- Patent Title (中): 耦合器
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Application No.: US12954783Application Date: 2010-11-26
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Publication No.: US08525614B2Publication Date: 2013-09-03
- Inventor: Toshiyasu Fujiwara , Takeshi Suga
- Applicant: Toshiyasu Fujiwara , Takeshi Suga
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC.
- Priority: JP2009-272227 20091130; JP2009-272231 20091130
- Main IPC: H01P5/12
- IPC: H01P5/12 ; H01P5/00

Abstract:
According to an embodiment of the invention, a coupler has a first line that includes a coiled main line and a second line that includes a coiled secondary line arranged to oppose the main line via an insulating layer. The coupler also has a plurality of vias that connect the separate portions of the first line arranged in the different layers and connect the separate portions of the second line arranged in the different layers, and a plurality of terminals each connected to an end of the first and second lines. The vias include an extension via connected to the main line or the secondary line that extends through the insulating layer, and the extension via wires the first line and the second line to the same side of the insulating layer.
Public/Granted literature
- US20110128091A1 COUPLER Public/Granted day:2011-06-02
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