Invention Grant
- Patent Title: Method for manufacturing array substrate and array substrate, and method for manufacturing screen and screen
- Patent Title (中): 阵列基板和阵列基板的制造方法以及屏幕和屏幕的制造方法
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Application No.: US13445047Application Date: 2012-04-12
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Publication No.: US08526107B2Publication Date: 2013-09-03
- Inventor: Atsushi Saito , Kazuo Aoki , Shintaro Yoshitome
- Applicant: Atsushi Saito , Kazuo Aoki , Shintaro Yoshitome
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: ALG Intellectual Property, LLC
- Priority: JP2011-089832 20110414
- Main IPC: G03B21/56
- IPC: G03B21/56
Abstract:
A method for manufacturing an array substrate includes forming a plurality of holes in a film shape substrate having thermal plasticity, in which the holes have a diameter of 0.25 times to 2 times a thickness of the substrate, and a pitch of 5 times to 40 times the diameter of the holes; and heating a molding member provided with a plurality of convex portions or concave portions in an array pattern, pressing the substrate provided with the plurality of holes, and transferring the plurality of convex portions or concave portions to the substrate.
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