Invention Grant
- Patent Title: Supporting structure module and electronic device using the same
- Patent Title (中): 支持结构模块和电子设备使用相同
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Application No.: US13160519Application Date: 2011-06-15
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Publication No.: US08526171B2Publication Date: 2013-09-03
- Inventor: Jiun-Lin Wu , Chia-Hsiang Hsiang , Ching-Hao Yu
- Applicant: Jiun-Lin Wu , Chia-Hsiang Hsiang , Ching-Hao Yu
- Applicant Address: TW Beitou District, Taipei
- Assignee: Pegatron Corporation
- Current Assignee: Pegatron Corporation
- Current Assignee Address: TW Beitou District, Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW99120290A 20100622
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
This disclosure provides a supporting structure module and an electronic device using the same. The supporting structure module in the invention is used in the electronic device. The electronic device includes a first casing, a hinge, and a second casing rotatable relative to the first casing via the hinge. The supporting structure module includes a first supporting structure, and the first supporting structure includes a first bracket and a first hinge cover. The first bracket is fixed to and exposed from the first casing. The first hinge cover is connected with the first bracket by integral forming, and the first hinge cover is exposed from the first casing and covers a part of the hinge.
Public/Granted literature
- US20110310541A1 SUPPORTING STRUCTURE MODULE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2011-12-22
Information query