Invention Grant
- Patent Title: Fan for cooling multiple processors housed in a sub-chassis
- Patent Title (中): 用于冷却容纳在子机箱中的多个处理器的风扇
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Application No.: US12773629Application Date: 2010-05-04
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Publication No.: US08526177B2Publication Date: 2013-09-03
- Inventor: David M. Paquin , John D. Nguyen , Michael L. Sabotta , Larry E. Wilson
- Applicant: David M. Paquin , John D. Nguyen , Michael L. Sabotta , Larry E. Wilson
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00
Abstract:
A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.
Public/Granted literature
- US20110273841A1 FAN FOR COOLING MULTIPLE PROCESSORS HOUSED IN A SUB-CHASSIS Public/Granted day:2011-11-10
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