Invention Grant
- Patent Title: Housing for encasing an object having an electrical connection
- Patent Title (中): 用于封装具有电连接的物体的壳体
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Application No.: US13689663Application Date: 2012-11-29
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Publication No.: US08526180B2Publication Date: 2013-09-03
- Inventor: Gary Rayner
- Applicant: TreeFrog Developments, Inc.
- Applicant Address: US CA San Diego
- Assignee: TreeFrog Development, Inc.
- Current Assignee: TreeFrog Development, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H04M1/00 ; B65D85/00

Abstract:
This disclosure relates generally to an apparatus and/or system for housing a device. The apparatus includes a housing that is configured such that a device may be fitted within the housing and thereby be protected, such as from shocks and/or liquid. The housing may include top and bottom members that may be removably coupled together so as to form the housing. Each top and bottom member optionally includes front and back surfaces surrounded by a perimeter. The perimeter is defined by proximal and distal ends as well as opposing sides. The top and bottom members may include respective clasping mechanisms that extend along the perimeter of the top and bottom members. The clasping mechanisms are configured for coupling the top and bottom members with one another thereby sealing the housing, for instance, in a shockproof and/or water tight seal.
Public/Granted literature
- US20130088130A1 HOUSING FOR ENCASING AN OBJECT HAVING AN ELECTRICAL CONNECTION Public/Granted day:2013-04-11
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