Invention Grant
- Patent Title: Devices having a thermal interface and methods of forming the same
- Patent Title (中): 具有热界面的装置及其形成方法
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Application No.: US12556293Application Date: 2009-09-09
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Publication No.: US08526184B2Publication Date: 2013-09-03
- Inventor: Robert C. Sullivan , Michael R. Palis , Ryan Pellecchia
- Applicant: Robert C. Sullivan , Michael R. Palis , Ryan Pellecchia
- Applicant Address: US NC Charlotte
- Assignee: Curtiss-Wright Controls, Inc.
- Current Assignee: Curtiss-Wright Controls, Inc.
- Current Assignee Address: US NC Charlotte
- Agency: Onello & Mello, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.
Public/Granted literature
- US20110058335A1 DEVICES HAVING A THERMAL INTERFACE AND METHODS OF FORMING THE SAME Public/Granted day:2011-03-10
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