Invention Grant
US08526185B2 Collar for electrically grounding a heat sink for a computer component
有权
用于将计算机部件的散热器电接地的轴环
- Patent Title: Collar for electrically grounding a heat sink for a computer component
- Patent Title (中): 用于将计算机部件的散热器电接地的轴环
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Application No.: US12906783Application Date: 2010-10-18
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Publication No.: US08526185B2Publication Date: 2013-09-03
- Inventor: Eric Heidepriem , Robert Grimes
- Applicant: Eric Heidepriem , Robert Grimes
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board.
Public/Granted literature
- US20120092826A1 COLLAR FOR ELECTRICALLY GROUNDING A HEAT SINK FOR A COMPUTER COMPONENT Public/Granted day:2012-04-19
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