Invention Grant
US08526186B2 Electronic assembly including die on substrate with heat spreader having an open window on the die
有权
电子组件包括在具有在模具上具有开放窗口的散热器的基板上的模具
- Patent Title: Electronic assembly including die on substrate with heat spreader having an open window on the die
- Patent Title (中): 电子组件包括在具有在模具上具有开放窗口的散热器的基板上的模具
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Application No.: US13180085Application Date: 2011-07-11
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Publication No.: US08526186B2Publication Date: 2013-09-03
- Inventor: Satoshi Yokoya , Margaret Rose Simmons-Matthews
- Applicant: Satoshi Yokoya , Margaret Rose Simmons-Matthews
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/24 ; H01L21/60
Abstract:
An electronic assembly includes a workpiece, a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon. The TSV die is attached to the workpiece with its topside on the workpiece. A heat spreader having an inner open window is on the bottomside of the TSV die. Bonding features are coupled to the TSV connectors or include the TSV connectors themselves. The bonding features protrude from the inner open window to a height above a height of the top of the heat spreader that allows a top die to be bonded thereto.
Public/Granted literature
- US20130016477A1 Electronic Assembly Including Die on Substrate With Heat Spreader Having an Open Window on the Die Public/Granted day:2013-01-17
Information query
