Invention Grant
- Patent Title: Semiconductor chip and method for manufacturing a semiconductor chip
- Patent Title (中): 半导体芯片及制造半导体芯片的方法
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Application No.: US12598747Application Date: 2008-04-24
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Publication No.: US08526476B2Publication Date: 2013-09-03
- Inventor: Karl Engl , Lutz Hoeppel , Christoph Eichler , Matthias Sabathil , Andreas Weimar
- Applicant: Karl Engl , Lutz Hoeppel , Christoph Eichler , Matthias Sabathil , Andreas Weimar
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102007021389 20070504; DE102007029370 20070626
- International Application: PCT/DE2008/000703 WO 20080424
- International Announcement: WO2008/135013 WO 20081113
- Main IPC: H01S5/00
- IPC: H01S5/00
Abstract:
A semiconductor chip with a semiconductor body has a semiconductor layer sequence with an active region provided for generating radiation. A mirror structure that includes a mirror layer and a dielectric layer that is arranged at least in regions between the mirror layer and semiconductor body is arranged on the semiconductor body.
Public/Granted literature
- US20100208763A1 Semiconductor Chip and Method for Manufacturing a Semiconductor Chip Public/Granted day:2010-08-19
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