Invention Grant
- Patent Title: Headphone set
- Patent Title (中): 耳机套
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Application No.: US12590416Application Date: 2009-11-09
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Publication No.: US08526657B2Publication Date: 2013-09-03
- Inventor: Yuji Yanagishita , Shinnosuke Katsuyama
- Applicant: Yuji Yanagishita , Shinnosuke Katsuyama
- Applicant Address: JP Yokohama-Shi, Kanagawa
- Assignee: JVC Kenwood Corporation
- Current Assignee: JVC Kenwood Corporation
- Current Assignee Address: JP Yokohama-Shi, Kanagawa
- Agency: Renner, Kenner, Greive, Bobak, Taylor & Weber
- Priority: JP2008-333420 20081226
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A headphone set is equipped with left- and right-ear headphone units. Each unit includes a housing body having a first plane section and a second plane section that faces the first section, the sections being almost perpendicular to a cross section of a cavum conchae of a user's ear when the housing body is fit in the cavum conchae, a speaker and a microphone aligned between the sections, the speaker being located at the first section side, the microphone being located at the second section side. A sound output section is provided at the first section, to give off sounds output by the speaker to an outer space of the housing body. A sound pick-up hole is provided at the second section, through which the outer space communicates with an inner space of the housing body created between a sound pick-up section of the microphone and the second section.
Public/Granted literature
- US20100166204A1 Headphone set Public/Granted day:2010-07-01
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