Invention Grant
- Patent Title: Methods and apparatus for detecting multiple objects
- Patent Title (中): 用于检测多个物体的方法和装置
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Application No.: US13005989Application Date: 2011-01-13
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Publication No.: US08526709B2Publication Date: 2013-09-03
- Inventor: Robert Bond , Fareed Nabkel , Richard Adachi
- Applicant: Robert Bond , Fareed Nabkel , Richard Adachi
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: IPSG, P.C. Intellectual Property Law
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method for determining physical placement data for a plurality of wafers is disclosed. The method includes obtaining raw CCD array data from a linear CCD array by clocking data from pixels of the linear CCD array into memory cells of the memory device and ascertaining pixel transition data to determine whether at least one of an upper edge error, a lower edge error, a wafer thickness error, and transition-per-slot error exists. If an error is found, the method includes generating an error signal.
Public/Granted literature
- US20120183200A1 METHODS AND APPARATUS FOR DETECTING MULTIPLE OBJECTS Public/Granted day:2012-07-19
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