Invention Grant
US08526709B2 Methods and apparatus for detecting multiple objects 有权
用于检测多个物体的方法和装置

Methods and apparatus for detecting multiple objects
Abstract:
A method for determining physical placement data for a plurality of wafers is disclosed. The method includes obtaining raw CCD array data from a linear CCD array by clocking data from pixels of the linear CCD array into memory cells of the memory device and ascertaining pixel transition data to determine whether at least one of an upper edge error, a lower edge error, a wafer thickness error, and transition-per-slot error exists. If an error is found, the method includes generating an error signal.
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