Invention Grant
- Patent Title: Method for cutting a material layer by means of a cutting beam
- Patent Title (中): 通过切割梁切割材料层的方法
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Application No.: US12966754Application Date: 2010-12-13
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Publication No.: US08527084B2Publication Date: 2013-09-03
- Inventor: Walter Maurer
- Applicant: Walter Maurer
- Applicant Address: CH Aarwangen
- Assignee: Micromachining AG
- Current Assignee: Micromachining AG
- Current Assignee Address: CH Aarwangen
- Agency: Young & Thompson
- Priority: CH1937/09 20091217
- Main IPC: G06F9/00
- IPC: G06F9/00 ; G06F19/00

Abstract:
In the method for cutting a material layer (20) along a given cutting line (21), a cutting beam is moved so as to impinge on the material layer (20) laterally offset by a distance (W) from the cutting line (21). The distance (W) is determined as a function of the variations of the cutting speed at which the cutting beam is moved, and/or as a function of the deviations of the effective cutting beam cross-section from a circular shape.
Public/Granted literature
- US20110147347A1 METHOD FOR CUTTING A MATERIAL LAYER BY MEANS OF A CUTTING BEAM Public/Granted day:2011-06-23
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