Invention Grant
- Patent Title: Strength measurement for bond lines
- Patent Title (中): 粘结线的强度测量
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Application No.: US12621276Application Date: 2009-11-18
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Publication No.: US08527218B2Publication Date: 2013-09-03
- Inventor: Gary Ernest Georgeson , Richard Henry Bossi , Jeffrey Reyner Kollgaard
- Applicant: Gary Ernest Georgeson , Richard Henry Bossi , Jeffrey Reyner Kollgaard
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Yee & Associates, P.C.
- Main IPC: G01N3/24
- IPC: G01N3/24 ; B23B31/00
Abstract:
The different advantageous embodiments provide a method and apparatus for inspecting a structure. In one advantageous embodiment, an electromagnetic force is generated on a portion of a bond line for a plurality of parts in the structure. The structure contains a conductive material. A determination is made as to whether an inconsistency is present in the portion of the bond line after generating the electromagnetic force on the portion of the bond line.
Public/Granted literature
- US20110118994A1 Strength Measurement for Bond Lines Public/Granted day:2011-05-19
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