Invention Grant
- Patent Title: Serial communications links with bonded first-in-first-out buffer circuitry
- Patent Title (中): 串行通信链接与先进先出缓冲电路
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Application No.: US12823959Application Date: 2010-06-25
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Publication No.: US08527677B1Publication Date: 2013-09-03
- Inventor: Frederic Richard , Lambertus De Jong
- Applicant: Frederic Richard , Lambertus De Jong
- Applicant Address: US CA San Jose
- Assignee: Altera Corporation
- Current Assignee: Altera Corporation
- Current Assignee Address: US CA San Jose
- Agency: Treyz Law Group
- Agent David C. Kellogg
- Main IPC: G06F3/00
- IPC: G06F3/00

Abstract:
Serial communications circuitry is provided that has bonded first-in-first-out (FIFO) buffer circuitry. The circuitry may include state machine and barrel shifter circuitry that conveys data between the bonded FIFO circuitry and a bonded serial communications path. The bonded FIFO circuitry and the bonded lane may increase the efficiency of the serial communications circuitry by reducing the number of empty data bytes buffered in the FIFO circuitry and conveyed over the serial communications path.
Information query