Invention Grant
- Patent Title: Component mounting apparatus and method
- Patent Title (中): 组件安装装置及方法
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Application No.: US13143587Application Date: 2010-01-08
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Publication No.: US08528196B2Publication Date: 2013-09-10
- Inventor: Kazuaki Kosaka , Akira Kabeshita , Nobuhiko Muraoka , Syozo Kadota
- Applicant: Kazuaki Kosaka , Akira Kabeshita , Nobuhiko Muraoka , Syozo Kadota
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2009-002320 20090108; JP2009-014760 20090126; JP2009-069627 20090323
- International Application: PCT/JP2010/000077 WO 20100108
- International Announcement: WO2010/079759 WO 20100715
- Main IPC: H05K3/30
- IPC: H05K3/30 ; B23P19/00

Abstract:
A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.
Public/Granted literature
- US20110289772A1 COMPONENT MOUNTING APPARATUS AND METHOD Public/Granted day:2011-12-01
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