Invention Grant
- Patent Title: Component mounting method
- Patent Title (中): 组件安装方法
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Application No.: US13255119Application Date: 2010-12-13
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Publication No.: US08528198B2Publication Date: 2013-09-10
- Inventor: Kenichiro Ishimoto
- Applicant: Kenichiro Ishimoto
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JPP2009-282490 20091214
- International Application: PCT/JP2010/007240 WO 20101213
- International Announcement: WO2011/074241 WO 20110623
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
When a component mounting process by mounting heads is executed on substrates which are positioned alternately by two substrate carrying lines, a determination is made on whether or not a mounting turn can be completed every time the mounting heads perform the mounting turn, and when it is determined that one of the mounting turns performed by the mounting head cannot be completed, a component mounting process is executed on the substrate which is positioned by the substrate carrying line which is opposite to the substrate carrying line.
Public/Granted literature
- US20120240388A1 COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING DEVICE Public/Granted day:2012-09-27
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