Invention Grant
- Patent Title: Manufacturing apparatus for wiring harnesses and a manufacturing method for wiring harnesses
- Patent Title (中): 线束制造装置及线束制造方法
-
Application No.: US12003588Application Date: 2007-12-28
-
Publication No.: US08528199B2Publication Date: 2013-09-10
- Inventor: Hisaomi Chikyu
- Applicant: Hisaomi Chikyu
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H05K3/00

Abstract:
For inserting terminals into each connector housing and reducing working area in processes by eliminating rearrangement of wires with terminals, a manufacturing method for wiring harnesses, including the steps of: picking up both ends of a wire at a predetermined position in a transferring direction from a transferring device by a pair of chucks, each chuck picking up one of the both ends of the wire; chucking the both ends of the wire with terminals fed through the pair of chucks, each end of the wire being fed through one of the pair of chucks, by a pair of terminal inserting heads as the terminal inserting device, the pair of terminal inserting heads moving freely independently of each other at least in a direction of a row of a connector housings; and inserting the terminals at the both ends simultaneously into each of the connector housings.
Public/Granted literature
- US20080113555A1 Manufacturing apparatus for wiring harnesses and a manufacturing method for wiring harnesses Public/Granted day:2008-05-15
Information query