Invention Grant
- Patent Title: Joint cover assembly and kit comprising this joint cover assembly as well as installation method thereof
- Patent Title (中): 包括该接头盖组件的接头盖组件和套件及其安装方法
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Application No.: US12731645Application Date: 2010-03-25
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Publication No.: US08528285B2Publication Date: 2013-09-10
- Inventor: Sven Kornfalt
- Applicant: Sven Kornfalt
- Applicant Address: SE Trelleborg
- Assignee: Pergo (Europe) AB
- Current Assignee: Pergo (Europe) AB
- Current Assignee Address: SE Trelleborg
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Main IPC: E04F15/14
- IPC: E04F15/14

Abstract:
The invention relates to a joint cover assembly for covering a gap between two floor elements covering a subsurface, the assembly comprising a first molding element comprising an upper section having an exposed surface, the exposed surface comprising a décor, and a foot depending therefrom, wherein the foot has a gripping groove extending towards the exposed surface and being defined by two side walls; and a second molding element comprising an upper surface and a lower surface, to be joined to the first molding element, as well as an exposed surface comprising a décor, wherein the lower surface has a groove extending towards the upper surface and being defined by two side walls; characterized in that the joint cover assembly furthermore comprises a track having two upstanding sections, wherein the distance between the upstanding sections corresponds substantially to the width of the foot and also to the distance between a gripping groove's side wall and a proximal side wall of the second molding element's groove. Furthermore, the invention relates to a kit comprising such joint cover assembly. Finally, the invention relates to a method of covering a sub floor adjacent a floor element by using this joint cover assembly or this kit.
Public/Granted literature
- US20100242393A1 JOINT COVER ASSEMBLY AND KIT COMPRISING THIS JOINT COVER ASSEMBLY AS WELL AS INSTALLATION METHOD THEREOF Public/Granted day:2010-09-30
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