Invention Grant
- Patent Title: Robotic arm for transporting substrate in ultrahigh vacuum
- Patent Title (中): 用于在超高真空下运输基材的机器臂
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Application No.: US12626611Application Date: 2009-11-25
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Publication No.: US08528438B2Publication Date: 2013-09-10
- Inventor: Hsien-Chung Chen , Kun-Feng Huang
- Applicant: Hsien-Chung Chen , Kun-Feng Huang
- Applicant Address: TW Taoyuan County
- Assignee: Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National Defense
- Current Assignee: Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National Defense
- Current Assignee Address: TW Taoyuan County
- Main IPC: B25J17/00
- IPC: B25J17/00 ; B25J18/00

Abstract:
The invention provides a robotic arm for transporting a substrate in an ultrahigh vacuum including a carrier module and a drive module. The drive module includes a magnetic coupling, a first transmission module, a second transmission module, and a third transmission module. The magnetic coupling includes an inner shaft and an outer shaft. The first transmission module drives the first active unit of the magnetic coupling to turn a first passive unit of the inner shaft by magnetic force. The second transmission module drives the second active unit of the magnetic coupling to turn a second passive unit of the outer shaft by magnetic force. The third transmission module drives the magnetic coupling and the carrier module to perform vertical movement. The carrier module will achieve rotational motion or extending motion when the inner shaft and the outer shaft are driven by the first transmission module and the second transmission module of the drive module.
Public/Granted literature
- US20110120251A1 ROBOTIC ARM FOR TRANSPORTING SUBSTRATE IN ULTRAHIGH VACUUM Public/Granted day:2011-05-26
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