Invention Grant
- Patent Title: Adhesive tape application device
- Patent Title (中): 胶带应用装置
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Application No.: US13063650Application Date: 2008-09-21
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Publication No.: US08528616B2Publication Date: 2013-09-10
- Inventor: Dieter Lessig , Christoph Böhler
- Applicant: Dieter Lessig , Christoph Böhler
- Applicant Address: DE Furth
- Assignee: Bohler GmbH
- Current Assignee: Bohler GmbH
- Current Assignee Address: DE Furth
- Agency: Lucas & Mercanti, LLP
- International Application: PCT/EP2008/007959 WO 20080921
- International Announcement: WO2010/031422 WO 20100325
- Main IPC: B65D85/02
- IPC: B65D85/02 ; B65H35/07

Abstract:
The invention relates to an adhesive tape application device for applying an adhesive tape section to an object, wherein the adhesive tape application device is designed for pulling an adhesive tape end from a supply of adhesive tape and applying said adhesive tape end to the object as an adhesive tape section by a relative motion of a movable portion and a stationary portion arranged on the object, comprising an application device, wherein the application device is designed and/or arranged for pressing the adhesive tape section against the object in an application position of the application device, wherein the application device is designed and/or arranged for performing a superimposed rotational-linear and/or swivelling-linear movement in the adhesive tape application device.
Public/Granted literature
- US20110186233A1 ADHESIVE TAPE APPLICATION DEVICE Public/Granted day:2011-08-04
Information query
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