Invention Grant
- Patent Title: Multi-stage spring system
- Patent Title (中): 多级弹簧系统
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Application No.: US12106369Application Date: 2008-04-21
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Publication No.: US08528885B2Publication Date: 2013-09-10
- Inventor: Jun Jason Yao
- Applicant: Jun Jason Yao
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Kirton McConkie
- Main IPC: F16F1/18
- IPC: F16F1/18

Abstract:
Embodiments of a multi-stage spring system are provided herein. In some embodiments, a multi-stage spring system includes a spring assembly having at least one resilient element, wherein the spring assembly has a first spring constant when deflected up to a first distance, a greater, second spring constant when deflected beyond the first distance and up to a second distance, and a greater, third spring constant when deflected beyond the second distance and up to a third distance, and wherein the spring assembly stores mechanical energy when deflected towards a contact surface that biases the spring assembly away from the contact surface when released.
Public/Granted literature
- US20090261517A1 MULTI-STAGE SPRING SYSTEM Public/Granted day:2009-10-22
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