Invention Grant
- Patent Title: Device and method for supporting a substrate
- Patent Title (中): 用于支撑衬底的装置和方法
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Application No.: US12748652Application Date: 2010-03-29
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Publication No.: US08528889B2Publication Date: 2013-09-10
- Inventor: Seiji Nakano , Michiaki Matsushita , Naruaki Iida , Suguru Enokida , Katsuhiro Morikawa
- Applicant: Seiji Nakano , Michiaki Matsushita , Naruaki Iida , Suguru Enokida , Katsuhiro Morikawa
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown
- Priority: JP2009-087150 20090331; JP2009-088309 20090331; JP2009-088310 20090331
- Main IPC: B23Q3/00
- IPC: B23Q3/00 ; B25B1/00

Abstract:
A substrate support device including a support member having a lower-surface support section to support a lower surface of a substrate; and a position restriction section provided on the lower-surface support section, the position restriction section being formed to surround a periphery of the substrate supported on the lower-surface support section and restrict a position of the substrate. At least one of the lower-surface support section and the position restriction section includes a base material and a protective film formed to cover the base material and prevent at least one of wear and chemical erosion to which the base material will be subject. The substrate support device further includes, for example, a base that supports the support member, and a driving structure that moves the support member in a relative fashion with respect to the base, and is constructed as a substrate transport device.
Public/Granted literature
- US20100243168A1 DEVICE AND METHOD FOR SUPPORTING A SUBSTRATE Public/Granted day:2010-09-30
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