Invention Grant
- Patent Title: Reduction of arc-tracking in chip on flexible circuit substrates
- Patent Title (中): 在柔性电路基板上减少芯片中的电弧跟踪
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Application No.: US13314071Application Date: 2011-12-07
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Publication No.: US08529022B2Publication Date: 2013-09-10
- Inventor: Mirza Sabanovic , David P Platt , Chad David Freitag , Joseph Andrew Broderick
- Applicant: Mirza Sabanovic , David P Platt , Chad David Freitag , Joseph Andrew Broderick
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Marger Johnson & McCollom PC
- Main IPC: B41J2/05
- IPC: B41J2/05

Abstract:
A flexible circuit substrate has an integrated circuit mounted on the substrate, a first set of traces arranged to connect between a first voltage source and a first set of connectors on the integrated circuit, a second set of traces arranged to connect between a second voltage source and a second set of connectors on the integrated circuit, and a gap in the flexible circuit substrate between the first and second set of traces, the gap of sufficient width to stop an electrical arc-tracking between the first set of traces and the second set of traces. The substrate may have a second gap between the first gap and other traces.
Public/Granted literature
- US20130147878A1 REDUCTION OF ARC-TRACKING IN CHIP ON FLEXIBLE CIRCUIT SUBSTRATES Public/Granted day:2013-06-13
Information query
IPC分类: