Invention Grant
- Patent Title: High-pressure pump
- Patent Title (中): 高压泵
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Application No.: US13008200Application Date: 2011-01-18
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Publication No.: US08529220B2Publication Date: 2013-09-10
- Inventor: Yoshihito Suzuki , Masahiro Fukui , Shinobu Oikawa
- Applicant: Yoshihito Suzuki , Masahiro Fukui , Shinobu Oikawa
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2010-7899 20100118; JP2010-147696 20100629
- Main IPC: F04B49/00
- IPC: F04B49/00

Abstract:
A housing of a high-pressure pump defines a passage communicating with a pressurizing chamber in which fuel is pressurized. The passage has an annular engagement groove which is radially outwardly concaved on its inner wall surface. A valve body is disposed in the passage. The engaged member is disposed inside of the passage wall. A valve body engaging member is comprised of a plurality of arc-shaped plate members, which form circular shape. The valve body engaging member is inserted into the engagement groove in such a manner as to be engaged with the valve body. A C-ring is firmly in contact with the plate members and biases them toward the engagement groove.
Public/Granted literature
- US20110176944A1 HIGH-PRESSURE PUMP Public/Granted day:2011-07-21
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