Invention Grant
- Patent Title: Electrical engagement apparatus, system and method
- Patent Title (中): 电气接合装置，系统和方法
-
Application No.: US12995743Application Date: 2009-05-12
-
Publication No.: US08529280B2Publication Date: 2013-09-10
- Inventor: Chin Hua Lim
- Applicant: Chin Hua Lim
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Robert S. Moshrefzadeh
- Priority: SG200804324-2 20080606
- International Application: PCT/US2009/043522 WO 20090512
- International Announcement: WO2009/148770 WO 20091210
- Main IPC: H01R4/50
- IPC: H01R4/50
Abstract:
A device for securing a first electrical connector to a second electrical connector, comprising a bracket body; and at least one engaging portion extending from the bracket body to the second electrical connector and coupling to a portion of the second electrical connector. Also provided is a method of securing one electrical connector to another electrical connector and an interconnect system comprising a first connector, a second connector, a third connector, and an engaging device.
Public/Granted literature
- US20110086534A1 ELECTRICAL ENGAGEMENT APPARATUS, SYSTEM AND METHOD Public/Granted day:2011-04-14
Information query
