Invention Grant
US08529295B2 Surface mount multi-connector and electronic apparatus having the same
失效
表面安装多连接器和具有该连接器的电子设备
- Patent Title: Surface mount multi-connector and electronic apparatus having the same
- Patent Title (中): 表面安装多连接器和具有该连接器的电子设备
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Application No.: US13165612Application Date: 2011-06-21
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Publication No.: US08529295B2Publication Date: 2013-09-10
- Inventor: Daisuke Sasaki , Takayuki Nagata
- Applicant: Daisuke Sasaki , Takayuki Nagata
- Applicant Address: JP Osaka
- Assignee: Hosiden Corporation
- Current Assignee: Hosiden Corporation
- Current Assignee Address: JP Osaka
- Agent David N. Lathrop
- Priority: JP2010-154028 20100706
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A surface mount multi-connector having movable contact sections with high contact reliability and providing connection portions with high coplanarity. The surface mount multi-connector includes a first body in which a plurality of first contacts having movable contact sections and end sections that extend oppositely to each other are held by insert molding, a second body in which a plurality of second contacts having movable contact sections and end sections that extend oppositely to each other are held by insert molding, and a third body that incorporates the first body with which the second body has been coupled so that the movable contact sections of the second contacts and the movable contacts section of the first contacts face in the same direction. Tips ahead of the movable contact sections of the first and second contacts elastically mate with catching parts formed on the inner wall of the third body, and connection portions of the end sections of the first contacts and connection portions of the end sections of the second contacts lie in a same plane.
Public/Granted literature
- US20120009824A1 Surface Mount Multi-Connector and Electronic Apparatus Having the Same Public/Granted day:2012-01-12
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