Invention Grant
- Patent Title: Joint filler composition
- Patent Title (中): 接头填料组成
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Application No.: US13453031Application Date: 2012-04-23
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Publication No.: US08529691B2Publication Date: 2013-09-10
- Inventor: Tsuyoshi Goto
- Applicant: Tsuyoshi Goto
- Applicant Address: JP Tokyo
- Assignee: Yoshino Gypsum Co., Ltd.
- Current Assignee: Yoshino Gypsum Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2011-104523 20110509; JP2012-072169 20120327
- Main IPC: C04B11/00
- IPC: C04B11/00 ; C04B14/00 ; C04B14/10 ; C04B14/20 ; C04B14/24 ; C04B28/14
Abstract:
A joint filler composition may include 100 parts by mass of a base material, 1 to 20 parts by mass of inorganic hollow particles, and 3 to 20 parts by mass of a mineral having a chain structure or a layer structure.
Public/Granted literature
- US20120285348A1 JOINT FILLER COMPOSITION Public/Granted day:2012-11-15
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