Invention Grant
US08529729B2 Plasma processing chamber component having adaptive thermal conductor
有权
具有自适应热导体的等离子体处理室部件
- Patent Title: Plasma processing chamber component having adaptive thermal conductor
- Patent Title (中): 具有自适应热导体的等离子体处理室部件
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Application No.: US12794907Application Date: 2010-06-07
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Publication No.: US08529729B2Publication Date: 2013-09-10
- Inventor: Tom Stevenson , Michael Dickens
- Applicant: Tom Stevenson , Michael Dickens
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Buchanan Ingersoll & Rooney PC
- Main IPC: C23F1/00
- IPC: C23F1/00
Abstract:
An assembly comprises a component of a plasma process chamber, a thermal source and a polymer composite therebetween exhibiting a phase transition between a high-thermal conductivity phase and a low-thermal conductivity phase. The temperature-induced phase change polymer can be used to maintain the temperature of the component at a high or low temperature during multi-step plasma etching processes.
Public/Granted literature
- US20110300714A1 PLASMA PROCESSING CHAMBER COMPONENT HAVING ADAPTIVE THERMAL CONDUCTOR Public/Granted day:2011-12-08
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