Invention Grant
- Patent Title: High-temperature attachment of organic molecules to substrates
- Patent Title (中): 将有机分子高温附着于底物
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Application No.: US11688194Application Date: 2007-03-19
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Publication No.: US08529996B2Publication Date: 2013-09-10
- Inventor: David F. Bocian , Jonathan S. Lindsey , Zhiming Liu , Amir A. Yasseri , Veena Misra , Qian Zhao , Qiliang Li , Shyam Surthi , Robert S. Loewe
- Applicant: David F. Bocian , Jonathan S. Lindsey , Zhiming Liu , Amir A. Yasseri , Veena Misra , Qian Zhao , Qiliang Li , Shyam Surthi , Robert S. Loewe
- Applicant Address: US CA Oakland US NC Raliegh
- Assignee: The Regents of the University of California,North Carolina State University
- Current Assignee: The Regents of the University of California,North Carolina State University
- Current Assignee Address: US CA Oakland US NC Raliegh
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Agent Tom Hunter
- Main IPC: C23C16/00
- IPC: C23C16/00

Abstract:
This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.
Public/Granted literature
- US20070212897A1 HIGH-TEMPERATURE ATTACHMENT OF ORGANIC MOLECULES TO SUBSTRATES Public/Granted day:2007-09-13
Information query
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