Invention Grant
US08530003B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device
有权
聚苯并恶唑前体，使用其的感光性树脂组合物，以及半导体装置的制造方法
- Patent Title: Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device
- Patent Title (中): 聚苯并恶唑前体，使用其的感光性树脂组合物，以及半导体装置的制造方法
-
Application No.: US13352589Application Date: 2012-01-18
-
Publication No.: US08530003B2Publication Date: 2013-09-10
- Inventor: Kenichiro Sato , Tsukasa Yamanaka
- Applicant: Kenichiro Sato , Tsukasa Yamanaka
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-253011 20060919
- Main IPC: C08J7/04
- IPC: C08J7/04 ; C08G61/12 ; H01L21/31 ; G03C1/00
Abstract:
A polybenzoxazole precursor is represented by the following formula (1): wherein R1a to R4a, R1b to R4b, X1, Y1 and m are defined in the specification.
Public/Granted literature
Information query
