Invention Grant
- Patent Title: Method for forming resist pattern
- Patent Title (中): 形成抗蚀剂图案的方法
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Application No.: US13357618Application Date: 2012-01-25
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Publication No.: US08530146B2Publication Date: 2013-09-10
- Inventor: Hirokazu Sakakibara , Hiromu Miyata , Koji Ito , Taiichi Furukawa
- Applicant: Hirokazu Sakakibara , Hiromu Miyata , Koji Ito , Taiichi Furukawa
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2011-023374 20110204; JP2011-186429 20110829; JP2011-202133 20110915
- Main IPC: G03F7/26
- IPC: G03F7/26
Abstract:
A radiation-sensitive resin composition includes an acid-labile group-containing polymer and photoacid generator. The radiation-sensitive resin composition is used to form a resist pattern using a developer that includes an organic solvent in an amount of 80 mass % or more. The radiation-sensitive resin composition has a contrast value γ of 5.0 to 30.0. The contrast value γ is calculated from a resist dissolution contrast curve obtained when developing the radiation-sensitive resin composition using the organic solvent.
Public/Granted literature
- US20120202150A1 RADIATION-SENSITIVE RESIN COMPOSITION Public/Granted day:2012-08-09
Information query
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