Invention Grant
US08530248B2 Method for placing a component onto a target platform by an apparatus using a probe
有权
通过使用探头的装置将部件放置在目标平台上的方法
- Patent Title: Method for placing a component onto a target platform by an apparatus using a probe
- Patent Title (中): 通过使用探头的装置将部件放置在目标平台上的方法
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Application No.: US12779051Application Date: 2010-05-13
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Publication No.: US08530248B2Publication Date: 2013-09-10
- Inventor: Kong-Chen Chen
- Applicant: Kong-Chen Chen
- Applicant Address: US CA Milpitas
- Assignee: Wintec Industries, Inc.
- Current Assignee: Wintec Industries, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Kilpatrick Townsend and Stockton LLP
- Main IPC: H01L21/26
- IPC: H01L21/26
Abstract:
The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
Public/Granted literature
- US20110210329A1 Apparatus and method for predetermined component placement to a target platform Public/Granted day:2011-09-01
Information query
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