中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US08530250B2 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body 有权
发光元件，树脂封装，树脂成形体，以及制造发光元件，树脂封装和树脂成形体的方法

Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
Abstract:
Provided is a simple and low-cost method for manufacturing, in a short time, many light emitting devices wherein adhesiveness between a leadframe and a thermosetting resin composition is high. The method for manufacturing the light emitting device having a resin package (20) wherein the optical reflectivity at a wavelength of 350-800 nm after thermal curing is 70% or more and a resin section (25) and a lead (22) are formed on substantially a same surface on an outer surface (20b) has: a step of sandwiching a leadframe (21) provided with a notched section (21a) by an upper molding die (61) and a lower molding die (62); a step of transfer-molding a thermosetting resin (23) containing a light-reflecting substance (26), in a molding die (60) sandwiched by the upper molding die (61) and the lower molding die (62) and forming a resin-molded body (24) on the leadframe (21); and a step of cutting the resin-molded body (24) and the leadframe (21) along the notched section (21a).
Abstract(Chinese):

提供了一种在短时间内制造其中引线框和热固性树脂组合物之间的粘合性高的许多发光器件的简单且低成本的方法。 制造具有树脂封装（20）的发光器件的方法，其中热固化后350-800nm波长的光反射率为70％以上，树脂部分（25）和引线（22）形成 在外表面（20b）上的基本上相同的表面上具有：通过上模制件（61）和下成型模具（62）夹持设置有切口部分（21a）的引线框架（21）的步骤; 在由上成型模具（61）和下成型模具（62）夹持的成型模具（60）中，将含有光反射物质（26）的热固性树脂（23）转印成型的步骤，形成树脂 在引线框架（21）上的模塑体（24）; 以及沿着切口部分（21a）切割树脂模制体（24）和引线框架（21）的步骤。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0